Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people’s lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation’s history – from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they’re making history.

The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Defect Characterization and Analysis Engineer position located at our Linthicum, MD facility.

The Advanced Technology Lab (ATL), part of Northrop Grumman Microelectronics Center (NGMC), located outside of Baltimore, Maryland – where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading-edge technology development in Superconducting Electronics and SLCFET. Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems. The Defect Characterization and Analysis Engineer should possess some knowledge of thin film metrology, optical image review techniques and practices. The selected candidate should have an aptitude for data analysis, technology development and demonstrate an ability to communicate well with others and work equally well independently and as part of a team.

The Defect Characterization and Analysis Engineer will be responsible for but not limited to:

Monitoring and reporting baseline defectivity across a variety of inspection and review toolsets, analyzing and leading defect partition experiments, analyzing and presenting split results, reviewing and correcting defect classification, and training engineers and technicians in defect classification and analysis.

#NGATL

This position is required to be fully on-site.

This job may be filled as a Principal Defect Characterization and Analysis Engineer or Senior Principal Defect Characterization and Analysis Engineer based on the qualifications below.

Basic Qualifications for Principal Defect Characterization and Analysis Engineer:

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 5 years of semiconductor fabrication experience or a Master’s degree with 3 years of experience or PhD with 0 years
Hands-on and moderate understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
Hands-on and basic understanding of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Familiar with semiconductor processing areas
In depth knowledge of statistical process control
In depth knowledge of Root Cause and Corrective Action Analysis for inline defectivity
Hands on experience with 6- and 8-inch Silicon substrates
Ability to work in a cleanroom setting
Ability to obtain and maintain a Secret clearance
US citizenship required

Basic Qualifications for Senior Principal Defect Characterization and Analysis Engineer:

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 8 years of semiconductor fabrication experience or a Master’s degree with 6 years of experience or a PhD with 3 years of experience
Hands-on and moderate understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
Hands-on and moderate understanding of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Familiar of semiconductor processing areas
In depth knowledge of statistical process control
In depth knowledge of Root Cause and Corrective Action Analysis for inline defectivity
Hands on experience with 6- and 8-inch Silicon substrates
Ability to work in a cleanroom setting
Ability to obtain and maintain a Secret clearance
US citizenship required

Preferred Qualifications:

Experience leading defect excursion and root cause analysis including Six Sigma practices
Led defect partitions improving overall yield
Capable of setting up and piloting defect inspection and analysis with new product technology lines
Experience in lean manufacturing practices and structured problem-solving methodology
Experience working in a cleanroom setting
Data analysis and visualization (JMP)
JMP and Python scripting
Experience developing technical specifications for equipment procurement
Strong module leadership and regular reporting experience with stakeholders of various backgrounds
Active Secret clearance #NGMCFab

Salary Range: $105,400.00 – $158,000.00Salary Range 2: $131,100.00 – $196,700.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate’s experience, education, skills and current market conditions.

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

Principal / Senior Principal Defect Characterization and Analysis Engineer full_time

Northrop Grumman

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